ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,799, issued on Nov. 3, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Semiconductor module and manufacturing method therefor" wa... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,800, issued on Nov. 3, was assigned to Rohm Co. Ltd. (Kyoto, Japan). "Semiconductor device with different side surfaces thickness for a plur... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,801, issued on Nov. 3, was assigned to Mitsui High-tec Inc. (Fukuoka, Japan). "Metal component including conductive substrate with nickel la... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,802, issued on Nov. 3, was assigned to Valeo Equipements Electriques Moteur (Creteil Cedex, France). "Power module with overmoulding, device... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,804, issued on Nov. 3, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan). "Electronic apparatus" was invented by Kenichi K... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,805, issued on Nov. 3, was assigned to NEXPERIA B.V. (Nijmegen, Netherlands). "Semiconductor device and a method of manufacturing such semic... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,807, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package" was invented by Joonghy... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,808, issued on Nov. 3, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu City, Taiwan). "Semiconductor device having grounded buried o... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,809, issued on Nov. 3, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Package structure including inactive element, asse... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,810, issued on Nov. 3, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Package structure including inactive element, asse... Read More